|
GB-CuSn10銅合金
【GB-CuSn10銅合金】詳細(xì)信息
Chemical composition % of grade GB-CuSn10 ( CB480K )
|
A suffix -B is added to the designation to identify material in the form of ingots
|
|
Fe
|
Si
|
Mn
|
Ni
|
P
|
S
|
Al
|
Cu
|
Pb
|
Zn
|
Sb
|
Sn
|
-
|
|
max 0.15
|
max 0.01
|
max 0.1
|
max 1.8
|
max 0.05
|
max 0.04
|
max 0.01
|
88.5 - 90.5
|
max 0.8
|
max 0.5
|
max 0.15
|
9.3 - 11
|
Cu including Ni
|
Mechanical properties of grade GB-CuSn10 ( CB480K )
|
Rm - Tensile strength (MPa) (GS)
|
250
|
|
Rm - Tensile strength (MPa) (GM)
|
270
|
|
Rm - Tensile strength (MPa) (GC)
|
280
|
|
Rm - Tensile strength (MPa) (GZ)
|
280
|
|
Rp0.2 0.2% proof strength (MPa) (GS)
|
130
|
|
Rp0.2 0.2% proof strength (MPa) (GM)
|
160
|
|
Rp0.2 0.2% proof strength (MPa) (GC)
|
170
|
|
Rp0.2 0.2% proof strength (MPa) (GZ)
|
160
|
|
A - Min. elongation at fracture (%) (GS)
|
18
|
|
A - Min. elongation at fracture (%) (GM) or (GZ) or (GC)
|
10
|
|
Brinell hardness (HBW): (GS)
|
70
|
|
Brinell hardness (HBW): (GM) or (GC) or (GZ)
|
80
|
----------------------------------
GB-CuSn10錫青銅高強(qiáng)度、高導(dǎo)電、高精度和高的抗軟化溫度，又兼具適宜的加工性能，電鍍釬焊性能。主要用于集成電路和電子分立器件的制作,電子工業(yè)接插件及大規(guī)模集成電路引線框架材料等。廣泛用于電子工業(yè)、計(jì)算機(jī)通訊設(shè)備等領(lǐng)域，使用情況良好。帶材精度高、板型良好、無殘余應(yīng)力。產(chǎn)品替代進(jìn)口，隨著高科技事業(yè)的發(fā)展，該精密銅帶的用量逐漸增加。
GB-CuSn10銅合金
●特性及適用范圍：
GB-CuSn10鑄造銅合金耐磨性和耐蝕性好，易加工，鑄造性能和氣密性較好。CuSn10-B鑄造銅合金用于在較高負(fù)荷，中等滑動(dòng)速度下工作的耐磨耐腐蝕零件，如軸瓦、襯套、缸套、活塞離合器、泵件壓蓋以及蝸輪等。
|
在線咨詢 
